• Purpose: Contact exposure means that the mask plate directly contacts with the photoresist layer of the substrate. The exposed graphics and the graphics on the mask plate have high resolution accuracy and simple equipment;
  

1. Semiconductor manufacturing;

2. Optoelectronics and flat plates;

3. RF microwave, diffractive optics;

4. MEMS;

5. Concave convex or crystal clad equipment, etc.

• Main specifications: line width can reach 800nm; A variety of models of positive and negative photoresist can be used together;
  

• Applicable chip size: the sample size cannot be greater than 6 inches.
  

• Product features:
  

1. The resolution is accurate;

2. Wider range of UV wavelength selection;

3. Support constant light intensity or constant power mode;

4. It is widely used in the fields of semiconductor, microelectronics, biological devices and nanotechnology.

• Instrument detailed parameters：